- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/66 - Structural association with built-in electrical component
Patent holdings for IPC class H01R 13/66
Total number of patents in this class: 3787
10-year publication summary
323
|
392
|
418
|
467
|
474
|
381
|
319
|
274
|
274
|
84
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
TE Connectivity Solutions GmbH | 2580 |
90 |
Yazaki Corporation | 6282 |
75 |
Apple Inc. | 50209 |
72 |
Foxconn Interconnect Technology Limited | 1034 |
68 |
Samsung Electronics Co., Ltd. | 131630 |
52 |
Sumitomo Wiring Systems, Ltd. | 9367 |
52 |
CommScope Technologies LLC | 4937 |
52 |
Hubbell Incorporated | 3052 |
41 |
Molex, LLC | 1792 |
41 |
Phoenix Contact E-mobility GmbH | 159 |
41 |
Panduit Corp. | 1007 |
38 |
Robert Bosch GmbH | 40953 |
35 |
Aptiv Technologies AG | 2097 |
32 |
Eaton Intelligent Power Limited | 6113 |
31 |
Hon Hai Precision Industry Co., Ltd. | 4157 |
30 |
Sumitomo Electric Industries, Ltd. | 14131 |
28 |
3m Innovative Properties Company | 18406 |
27 |
CommScope, Inc. of North Carolina | 647 |
26 |
Cisco Technology, Inc. | 18858 |
24 |
AutoNetworks Technologies, Ltd. | 5809 |
24 |
Other owners | 2908 |